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Low temperature resistance hot melt adhesive Flex+ 5052 for packaging

Flex+ 5052 hot melt polyamide adhesive is a thermoplastic hot melt PA granules based on dimer acids.

  • Item No.:

    Flex+ 5052
  • Color:

    Amber color
  • Appearance:

    Granules
  • MOQ:

    2 Tons
  • Features:

    Low temperature resistance
  • Product Details

DESCRIPTION

As Flex+ 5052 hot melt polyamide adhesive, its features include a medium softening point, long open time, low temperature flexibility and low viscosity. 

Flex+ 5052 hot melt polyamide adhesive is recommended for multipurpose assembly, woodworking, packaging and converting applications. It is 100% solid and soluble in organic solvents.


SPECIFICATION

Specifications Property

Detail or Method

Specification

Softening Point:

°C Ring and Ball ASTM E 28

120-130°C

Viscosity

cps/mPa·s at 190°C LVT Brookfield ASTM D 3236

2,000-3,200 cps

Color

40% in n-Butanol, Gardner

8 Maximum

Typical Values

Acid Value

mg KOH/g

8.0

Amine Value

mg KOH/g

0.8

Specific Gravity

At 25°C

0.97

Flash Point

°C, COC, ASTM D 6450

271


APPLICATION


Hot melt adhesive for packaging

Hot melt adhesive Flex+ 5052 can be used in Multi-components assembly, Woodworking, and Packaging.


PACKAGING

Hot melt adhesive Flex+ 5052 Package

Storage: Store at room temperature in a dry area.

Shipping Classification: Non-hazardous.


alcohol soluble Hot melt adhesive decision tree


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