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Low pressure molding Hot melt polyamide adhesive LPM 1025B

LPM 1025B is a thermoplastic hot melt adhesive based on polyamide, the field of its application is Low Pressure Molding.




  • Item No.:

    LPM 1025B
  • Color:

    Black or white color
  • Appearance:

    Granules
  • MOQ:

    2 Tons
  • Features:

    Low pressure molding
  • Product Details

Specifications

Property

Detail or Method

Specification

Softening Point:  

°C Ring and Ball ASTM E 28

150-165

Viscosity

cps/mPa·s at 190°C LVT Brookfield ASTM D 3236

1,800-3,200 cps

Color

40% in n-Butanol, Gardner

8 Maximum


Typical Values

Acid Value

mg KOH/g

9.5

Amine Value

mg KOH/g

1.0

Specific Gravity

At 25°C

0.97

Flash Point

°C, COC, ASTM D 6450

271


Handling suggestions

When substrates with high heat conductivity shall be bonded the use of a given application temperature is necessary for good wetting. The substrate surface should be free of dust and cleaned with a suitable solvent so that there is no fat and oil.

Do not heat the product over the mentioned application temperature range. Without using do not heat the product for a long time, because the quality can decrease or extremely the product cokes. The standby temperature is 80 °C.

LMP 1025B may adsorb moisture from the air. This will not be obvious in the solid form, but could cause foaming as the adhesive is melted which may result in poor bonds. Re close the container tightly as soon as sufficient adhesive has been removed for immediate use.


OTHER TIPS

Apparatus cleaning: Remove very strong coked and not thermoplastic rests of hot melt mechanically.

Safey precautions: No health hazards are expected when this product is in solid form. However, once melted it is like any hot liquid, which can produce severe burns. The appropriate safety precautions should be used (see also safety- data-sheet). If the molten adhesive has contacted your skin, cool the affected area immediately with cold water. Do not try to remove the adhesive from the skin. Go to your first aid station for attention.

Regulatios: On the base of the available data, the product is not a hazardous material according to the China chemical law or the hazardous substances regulations.

APPLICATION

Hot melt adhesive for electrical components application

LPM has the application systems for hot melt adhesive.


PACKAGING

Low pressure molding Hot melt adhesive package

From of supply: Granulate, store in 25 kg net weight bag.
storage: Up to max. +35 °C, min. 12 months in original closed container. Be sure that used container are closed immediately with insulation against moisture. Maybe the adhesive and application properties can decrease by storing with open containers.


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